actual time table for Cyberbond’s Fair- and Seminar Activities in 2010:
Bondexpo, Trade Fair for Bonding Technology
13.09. - 16.09.2010, in Stuttgart
Cyberbond’s booth will be in hall 7
Stand: 7503
www.bondexpo-messe.de
The Seminars’ Description
Bondexpo - Die Fachmesse für industrielle Klebetechnologie
„With the BONDexpo trade fair for industrial bonding technology, trade fair promoters P.E. Schall GmbH & Co. KG have closed a gap in the market – no independent industry showcase for this forward-looking range of topics existed beforehand. BONDexpo was held for the second time at the Stuttgart Exhibition Centre in September 2008. The event’s location at the heart of Baden-Württemberg’s industrial centres and the fact that it’s held concurrent to MOTEK (leading international trade fair for handling and assembly technology) assure ideal conditions for the still young business platform for bonding technology, which is plainly demonstrated by growth experienced between the first and second events."
http://www.bondexpo-messe.de/de/bondexpo/start
IFAM - Fraunhofer Institut Fertigungstechnik, Materialforschung, Bremen
Among others the Fraunhofer-Institut für Fertigungstechnik und Angewandte Materialforschung is actively researching and developing in the wide field of adhesive technologies. There are 300 people working in this Institute, more than 80 % are active in the technical sections.
http://www.ifam.fraunhofer.de/index.php?seite=/profil/
Haus der Technik e.V., Essen
is an Institute of Technical University Aachen
it co-operates with Universities Duisburg-Essen - Münster - Bonn - Braunschweig
www.hdt-essen.de/htd/verein/verein.html
Due to the great input of Ac. Prof. Eduardo Schindel-Bidinelli the Swiss Bonding became one of the most respected Adhesive Symposiums in Europe.
As one sponsor Cyberbond supports the Swiss Bonding in order to guarantee a simultaneous translation of all speeches. In addition to that Cyberbond’s Technical Director Dieter Rademacher is very much engaged in the Scientific Board of the Swiss Bonding and helps to define new themes for the following Symposiums and to keep the Seminars on the well known high level. In 2009 Dieter Rademacher will also do a presentation himself.
http://www.swissbonding.ch
|
